Position Overview

We are seeking an Expert PCB Designer to support the development of advanced, mission-critical electronic systems in a secure environment. This role requires deep expertise in high-speed digital, RF, and analog PCB design, with a focus on complex, multi-layer boards used in high-performance applications.

The ideal candidate will bring extensive experience designing cutting-edge PCB layouts, including HDI, fine-pitch BGAs, and high-speed interfaces up to 100 Gigabit Ethernet, while collaborating closely with cross-functional engineering teams.

Key Responsibilities

• Design and develop complex multi-layer PCB layouts for high-speed digital, RF, analog, microwave, and power applications
• Create high-density interconnect (HDI) designs, including fine-pitch BGA (.4mm) components and high pin-count devices
• Implement controlled impedance routing, including microstrip, stripline, and differential pair routing with matched lengths and delay control
• Develop layouts for DDR3/DDR4, LVDS, SerDes, Rocket I/O, JTAG, DSP, and high-speed interfaces up to 100 Gigabit Ethernet
• Perform RF layout design, including transmission lines, grounding, shielding, and isolation techniques to ensure optimal performance
• Design flex and rigid-flex circuits with complex mechanical constraints
• Define and implement blind and buried microvias for Class 3 PCB standards
• Collaborate with Electrical Engineers (EE), Mechanical Engineers (ME), and fabrication vendors to define:
  • Board stack-ups
  • Materials and laminates
  • Fabrication and assembly processes
• Integrate mechanical constraints using IDF, DXF, and STEP 3D files, including geometric dimensioning and tolerancing (GD&T)
• Apply EMI/EMC mitigation techniques and ensure compliance with IPC standards
• Support DFM (Design for Manufacturability) and DFA (Design for Assembly) processes
• Utilize tools such as Siemens / Mentor Graphics Xpedition (VX), EDM, and Valor NPI for design and validation
• Mentor junior designers and provide technical leadership as needed

Required Qualifications

• Active Secret Security Clearance (required to work in SCIF)
• 10+ years of experience in PCB design, with a focus on high-speed and RF systems
• Expertise in Mentor Graphics Xpedition (VX) / Siemens PCB tools and EDM
• Strong experience with:
  • High-speed digital and mixed-signal PCB design
  • RF and microwave layout techniques
  • Controlled impedance and signal integrity principles
• Proven experience designing complex, multi-layer PCBs (including 1TB-class designs)
• Hands-on experience with:
  • HDI design and microvias
  • Fine-pitch BGAs (.4mm)
  • DDR3/DDR4 memory layouts
  • High-speed protocols (LVDS, SerDes, 100GbE)
• Deep understanding of PCB materials, fabrication, and assembly processes
• Familiarity with IPC standards (Class 3 preferred)

Preferred Qualifications

• Experience with RF wire bonding and circuit partitioning using shield walls
• Strong background in low-noise RF/analog design techniques
• Experience working in defense, aerospace, or classified environments
• Prior experience mentoring or leading PCB design teams

Work Environment

• Onsite work required in a Secure Compartmented Information Facility (SCIF)
• Collaboration with multidisciplinary engineering teams in a fast-paced, high-security setting

Why Join

• Opportunity to work on cutting-edge, high-performance electronics
• Competitive hourly compensation
• Collaborative, engineering-driven environment with impactful, mission-critical work